The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant...http://www.google.de/patents/US20050062492?utm_source=gb-gplus-sharePatent US20050062492 - High density integrated circuit apparatus, test probe and methods of use thereof
