A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. The disclosed method first employs a thin metal layer (0502) deposited...http://www.google.de/patents/US7446388?utm_source=gb-gplus-sharePatent US7446388 - Integrated thin film capacitor/inductor/interconnect system and method
