A lead frame (201) for a packaged electronic device having split flag structures (205, 207) coupled by support structures (219). The support structures include bend portions (233) for providing stress relief between the flag structures during the manufacture and/or during the operation of a packaged...http://www.google.de/patents/US20050056920?utm_source=gb-gplus-sharePatent US20050056920 - Lead frame with flag support structure
