An apparatus and method is provided for forming the external leads of an IC, wherein the coplanarity of the tips of the plurality of external leads after external lead formation can be improved even with an IC in which the resin portion is curved. The apparatus comprises a plurality of resin support...http://www.google.de/patents/US5806571?utm_source=gb-gplus-sharePatent US5806571 - Apparatus and method for forming the external leads of an integrated circuit 
