The invention relates to an electronic component and a panel, the electronic component having a semiconductor chip with a wiring board and a plastic package. The plastic package is made up of two layers of plastic package molding compound arranged one on top of the other. These layers are created with...http://www.google.de/patents/US7034383?utm_source=gb-gplus-sharePatent US7034383 - Electronic component and panel and method for producing the same
