Methods for packaging microelectronic devices and microelectronic devices formed using such methods are disclosed herein. One aspect of the invention is directed toward a method for packaging a microelectronic device that includes coupling an active side of a microelectronic die to a surface of a support...http://www.google.de/patents/US7759221?utm_source=gb-gplus-sharePatent US7759221 - Methods for packaging microelectronic devices and microelectronic devices formed using such methods
