Semiconductor substrates with unitary vias and via terminals, and associated systems and methods are disclosed. A representative method in accordance with a particular embodiment includes forming a blind via in a semiconductor substrate, applying a protective layer to a sidewall surface of the via, and...http://www.google.de/patents/US8030780?utm_source=gb-gplus-sharePatent US8030780 - Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
