Multi-layered, planar microshells having low stress for encapsulation of devices such as MEMS and microelectronics. The microshells may include a perforated pre-sealing layer, below which a sacrificial layer is accessed, and a sealing layer to close the perforation in the pre-sealing layer after the...http://www.google.de/patents/US7595209?utm_source=gb-gplus-sharePatent US7595209 - Low stress thin film microshells
