Methods in accordance with the present invention provide a quasi-planarized surface between one or more semiconductor devices and at least a portion of surrounding passivation material, where the devices have different elevations above a substrate. A hard mask defines the planarized surface as the interface...http://www.google.de/patents/US6846740?utm_source=gb-gplus-sharePatent US6846740 - Wafer-level quasi-planarization and passivation for multi-height structures
