The nozzle arrangements are positioned on a substrate that incorporates drive circuitry. According to the method, the drive circuitry layers on the substrate are fabricated by means of CMOS fabrication process. A first sacrificial layer is deposited on the substrate. A heater layer for heating circuits...http://www.google.de/patents/US6929350?utm_source=gb-gplus-sharePatent US6929350 - Method of fabricating nozzle arrangements for an inkjet printhead chip
