An injection mold is described for producing the housings of integrated circuits. The injection mold icludes a first mold half (30) in which are disposed a number of mold recesses (46) corresponding to the number of housings to be made simultaneously, having a depth corresponding to a portion of the...http://www.google.de/patents/US4697784?utm_source=gb-gplus-sharePatent US4697784 - Injection mold for producing the housings of integrated circuits
