An interconnect overlies a semiconductor device substrate (10). In one embodiment, a conductive barrier layer overlies a portion of the interconnect, a passivation layer (92) overlies the conductive barrier layer and the passivation layer (92) has an opening that exposes portions of the conductive barrier...http://www.google.de/patents/US20020093098?utm_source=gb-gplus-sharePatent US20020093098 - Semiconductor device and method of formation
