In one embodiment, a device includes but is not limited to: a first integrated circuit affixed to a substrate; an electronic circuit component affixed to the substrate; a first encapsulation structure encasing the first integrated circuit; a second integrated circuit affixed to the first encapsulation...http://www.google.de/patents/US6998721?utm_source=gb-gplus-sharePatent US6998721 - Stacking and encapsulation of multiple interconnected integrated circuits
