The present invention provides a system, method and apparatus for testing multiple semiconductor wafers. The method includes the steps of attaching two or more wafer-interposer assemblies to a testing apparatus and testing each semiconductor die. Each wafer-interposer assembly comprises an interposer...http://www.google.de/patents/US6822469?utm_source=gb-gplus-sharePatent US6822469 - Method for testing multiple semiconductor wafers
