A method for passivating an integrated circuit includes the RF sputtering of a hard passivation layer on the surface of the integrated circuit. The hard passivation layer can be a ceramic material such as various doped and undoped titanates, zirconates, niobates, tantalates, stanates, hafnates, and manganates,...http://www.google.de/patents/US5438023?utm_source=gb-gplus-sharePatent US5438023 - Passivation method and structure for a ferroelectric integrated circuit using hard ceramic materials or the like
