Semiconductor processing methods of forming conductive projections and methods of increasing alignment tolerances are described. In one implementation, a conductive projection is formed over a substrate surface area and includes an upper surface and a side surface joined therewith to define a corner...http://www.google.de/patents/US6559057?utm_source=gb-gplus-sharePatent US6559057 - Semiconductor processing methods of forming a conductive projection and methods of increasing alignment tolerances
