A semiconductor device having reduced self and mutual capacitance of bonded wires is provided by coating the wires with a foamed polymer effectively having a very low dielectric constant. Additional benefits are realized by electrically insulating the wires against short-circuiting, by cushioning the...http://www.google.de/patents/US7195954?utm_source=gb-gplus-sharePatent US7195954 - Low capacitance coupling wire bonded semiconductor device
