A method for fabricating a semiconductor package with a substrate in a strip format is provided. Semiconductor devices are attached in a strip format to the substrate, and a thermal interface material is applied to the semiconductor devices. A flat panel heat spreader is attached to each semiconductor...http://www.google.de/patents/US7153725?utm_source=gb-gplus-sharePatent US7153725 - Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor
