A process intended for combining the "flip-chip bonding" technique with a method yielding diodes of very thin substrate forming mesa units or clumps etched out in a dielectric block embedding the semiconductor body. The process comprises, starting from a semiconductive wafer, a double mesa etching and...http://www.google.de/patents/US4097986?utm_source=gb-gplus-sharePatent US4097986 - Manufacturing process for the collective production of semiconductive junction devices
