Patent US7656029 - Cut-out heat slug for integrated circuit device packaging

In a package, a heat slug, encapsulated by molding compound, encases an integrated circuit device (IC). In an example embodiment, a semiconductor package structure comprises a substrate having conductive traces and pad landings. The conductive traces have pad landings. An IC is mounted on the substrate....http://www.google.de/patents/US7656029?utm_source=gb-gplus-sharePatent US7656029 - Cut-out heat slug for integrated circuit device packaging

Patente

Cut-out heat slug for integrated circuit device packaging