An inventive method tracks IC devices through the assembly steps in a manufacturing process. Prior to die attach, a laser scribe marks the lead frame of each of the devices with a coded hole matrix that gives each device a unique ID code. During die attach, an optical hole reader retrieves the ID code...http://www.google.de/patents/US7120287?utm_source=gb-gplus-sharePatent US7120287 - Non-lot based method for assembling integrated circuit devices
