A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to a frame that circumscribes the modulator array. The frame is bonded to the transparent...http://www.google.de/patents/US7715080?utm_source=gb-gplus-sharePatent US7715080 - Packaging a MEMS device using a frame
