An apparatus and method for enhancing thermal performance and electromagnetic interference (EMI) shielding in die-up array integrated circuit (IC) device packages is presented. A die-up array package includes an IC die mounted to a first stiffener surface. The package further includes a cap body having...http://www.google.de/patents/US7432586?utm_source=gb-gplus-sharePatent US7432586 - Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
