A method and apparatus for determining burn-in reliability from wafer level burn-in are disclosed. The method according to the present invention includes recording the number of failures in each IC die in nonvolatile elements on-chip at points in time over the duration of wafer level burn-in testing....http://www.google.de/patents/US7038481?utm_source=gb-gplus-sharePatent US7038481 - Method and apparatus for determining burn-in reliability from wafer level burn-in
