Heat sinks suitable for use, for example, as semiconductor heat sinks are formed from a unitary precision stamping consisting of at least one rail to which are attached a plurality of heat sink elements. Each of the heat sink elements is attached to the rail by a bridge region of reduced thickness. The...http://www.google.de/patents/US6338196?utm_source=gb-gplus-sharePatent US6338196 - Method of forming heat sinks having fully anodized surfaces
