One embodiment of the invention is a semiconductor system (1400) of arrays (1401, 1402, etc.) of packaged devices. Each array includes a sheet-like substrate (1411, 1412, etc.) made of insulating material integral with conductive horizontal lines and vertical vias, and terminals on the surfaces. Semiconductor...http://www.google.de/patents/US7892889?utm_source=gb-gplus-sharePatent US7892889 - Array-processed stacked semiconductor packages
