The present invention generally relates to filling of a feature by depositing a barrier layer, depositing a seed layer over the barrier layer, and depositing a conductive layer over the seed layer. In one embodiment, the seed layer comprises a copper alloy seed layer deposited over the barrier layer....http://www.google.de/patents/US20030059538?utm_source=gb-gplus-sharePatent US20030059538 - Integration of barrier layer and seed layer
