A method for treating a film of material, which can be defined on a substrate, e.g., silicon. The method includes providing a substrate comprising a cleaved surface, which is characterized by a predetermined surface roughness value. The substrate also has a distribution of hydrogen bearing particles...http://www.google.de/patents/US6171965?utm_source=gb-gplus-sharePatent US6171965 - Treatment method of cleaved film for the manufacture of substrates
