A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential...http://www.google.de/patents/US6126989?utm_source=gb-gplus-sharePatent US6126989 - Copper electroless deposition on a titanium-containing surface
