Methods and systems for removing materials from microfeature workpieces are disclosed. A method in accordance with one embodiment of the invention includes providing a microfeature workpiece having a substrate material and a conductive material that includes a refractory metal (e.g., tantalum, tantalum...http://www.google.de/patents/US20060042956?utm_source=gb-gplus-sharePatent US20060042956 - Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
