An encapsulant molding technique used in chip-on-board encapsulation wherein a residual organic compound layer on the surface of a substrate is used to facilitate removal of unwanted encapsulant material. An organic compound layer which inherently forms on the substrate during the fabrication of the...http://www.google.de/patents/US20010039120?utm_source=gb-gplus-sharePatent US20010039120 - Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device
