Microfeature workpieces having conductive vias formed by chemically reactive processes, and associated systems and methods are disclosed. A method in accordance with one embodiment includes disposing a conductive lining on walls of a via in a microfeature workpiece, so that a space is located between...http://www.google.de/patents/US7973411?utm_source=gb-gplus-sharePatent US7973411 - Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
