A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite the first surface, and a projection extending away from the first surface. A quantity of adhesive material...http://www.google.de/patents/US20030189262?utm_source=gb-gplus-sharePatent US20030189262 - Method and apparatus for attaching microelectronic substrates and support members
