An integrated circuit package including a multilayer ceramic substrate for mounting a plurality of integrated circuit chips on a first surface thereof. The substrate is provided with a power supply layer, a ground connection layer and circuit patterns. An array of coaxial pins is juxtaposed on the opposite...http://www.google.de/patents/US4819131?utm_source=gb-gplus-sharePatent US4819131 - Integrated circuit package having coaxial pins
