Effective fillability and the uniformity electrodeposition of a copper electroplating solution is judged by determining the time-dependent potential change thereof at a cathode current density of 0.1-20 A/dm2. The potential change is determined at a working electrode rotation of 100-7500 rpm, and the...http://www.google.de/patents/US20060183257?utm_source=gb-gplus-sharePatent US20060183257 - Method for analyzing electrolytic copper plating solution, and analyzing device therefor and production method for semi-conductor product
