Effective fillability and the uniformity electrodeposition of a copper electroplating solution is judged by determining the time-dependent potential change thereof at a cathode current density of 0.1-20 A/dm2. The potential change is determined at a working electrode rotation of 100-7500 rpm, and the...http://www.google.de/patents/US7820535?utm_source=gb-gplus-sharePatent US7820535 - Method for analyzing copper electroplating solution, apparatus for the analysis, and method for fabricating semiconductor product