Methods and apparatus pertaining to flip chip ball grid array packages are disclosed. A substrate comprises a base layer with a dielectric laminated thereon such that a cavity in the dielectric exposes the base layer. A die is then mounted to the exposed portion of the base layer. Preferably, an upper...http://www.google.de/patents/US6133064?utm_source=gb-gplus-sharePatent US6133064 - Flip chip ball grid array package with laminated substrate
