A resin sealing type semiconductor device capable of making a resin burr hard to occur when formed by molds and of restraining cracks in solder, is actualized by providing a stepped portion on a resin sealing body for covering a circuit forming surface of a semiconductor chip, making leads exposed from...http://www.google.de/patents/US5999413?utm_source=gb-gplus-sharePatent US5999413 - Resin sealing type semiconductor device
