A resin sealing type semiconductor device, a manufacturing method thereof and a packaging structure thereof are capable of downsizing the semiconductor device and attaining high-density packaging. For this, the resin sealing type semiconductor device with leads exposed in an outer surface, is provided...http://www.google.de/patents/US6403398?utm_source=gb-gplus-sharePatent US6403398 - Semiconductor device, manufacturing method thereof and aggregate type semiconductor device
