Process for manufacturing arrays of metal balls for interconnect testing and/or interconnect bonding of microelectronic devices and the like with substrates are formed by securing metal balls in predetermined patterns of apertures in an insulating membrane or film. The pattern of apertures corresponds...http://www.google.de/patents/US5861323?utm_source=gb-gplus-sharePatent US5861323 - Process for manufacturing metal ball electrodes for a semiconductor device
