Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material...http://www.google.de/patents/US20030029841?utm_source=gb-gplus-sharePatent US20030029841 - Method and apparatus for polishing metal and dielectric substrates
