When forming a contact hole by a conventional manufacturing step of a semiconductor device, a resist is required to be formed on almost entire surface of a substrate so as to be applied on a film other than an area in which a contact hole is to be formed, leading to drastically reduced throughput. According...http://www.google.de/patents/US7655499?utm_source=gb-gplus-sharePatent US7655499 - Forming method of contact hole and manufacturing method of semiconductor device, liquid crystal display device and EL display device
