Microelectronic devices, methods for packaging microelectronic devices, and methods for forming vias and conductive interconnects in microfeature workpieces and dies are disclosed herein. In one embodiment, a method includes forming a bond-pad on a die having an integrated circuit, the bond-pad being...http://www.google.de/patents/US7759800?utm_source=gb-gplus-sharePatent US7759800 - Microelectronics devices, having vias, and packaged microelectronic devices having vias
