In order to efficiently cool highly heat generating components mounted on an electronic device, it is necessary to provide a large heat sink, which is the heat dissipation member, and this entails the problem of an enlarged device size and accordingly an increased installation space. A heat receiving...http://www.google.de/patents/US20040070949?utm_source=gb-gplus-sharePatent US20040070949 - Electronic device having a heat dissipation member
