An apparatus for plating a conductive film directly on a substrate with a barrier layer on top includes anode rod (1) placed in tube (109), and anode rings (2), and (3) placed between cylindrical walls (107) and (105), (103) and (101), respectively. Anodes (1), (2), and (3) are powered by power supplies...http://www.google.de/patents/US20010040100?utm_source=gb-gplus-sharePatent US20010040100 - Plating apparatus and method
