A packaged integrated circuit that includes a substrate 310; a chip 300 mounted on the substrate; and a heatsink 350 mounted on the chip. The heatsink has a spacer 360 attached to one of its surfaces to provide a standoff distance between the heatsink and the substrate. The substrate and the heatsink...http://www.google.de/patents/US20040036162?utm_source=gb-gplus-sharePatent US20040036162 - Integrated circuit package with heatsink support
