A process of forming plated through-holes in a printed circuit board involves placing a film of fluid ink having electrically conductive properties on a side wall of the hole, curing the film to a solid and electroplating a layer of metal on the conductive ink film. The conductive ink preferably is a...http://www.google.de/patents/US4964948?utm_source=gb-gplus-sharePatent US4964948 - Printed circuit board through hole technique
