Methods are disclosed for manufacturing semiconductor device dies and for separating dies from a semiconductor wafer, wherein one or more channels are etched in the top of the wafer between individual die areas. Material is then removed from the bottom side of the wafer in order to separate the individual...http://www.google.de/patents/US20030022465?utm_source=gb-gplus-sharePatent US20030022465 - Method of separating semiconductor dies from a wafer
