This invention relates to a method for separating at least two wafers (1, 2) bonded together to form a stacked structure. At least one bending force is applied to all or part of the stacked structure to separate the stacked structure into two parts along a required separation plane....http://www.google.de/patents/US7264996?utm_source=gb-gplus-sharePatent US7264996 - Method for separating wafers bonded together to form a stacked structure
