The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated...http://www.google.de/patents/US7202555?utm_source=gb-gplus-sharePatent US7202555 - Pitch change and chip scale stacking system and method
